AMD XCZU1CG-L1SBVA484I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 1,226.01 | Dhs. 1,226.01 |
| 15+ | Dhs. 1,187.27 | Dhs. 17,809.05 |
| 25+ | Dhs. 1,161.46 | Dhs. 29,036.50 |
| 50+ | Dhs. 1,096.93 | Dhs. 54,846.50 |
| 100+ | Dhs. 967.88 | Dhs. 96,788.00 |
| N+ | Dhs. 193.58 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC FPGA - XCZU1CG-L1SBVA484I
The AMD XCZU1CG-L1SBVA484I is a high-performance, low-power MPSoC (Multiprocessor System-on-Chip) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with programmable FPGA logic. Engineered for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Dual-core ARM Cortex-A53 (1.2GHz) + Dual-core ARM Cortex-R5 (500MHz) for real-time processing and application workloads
- 256KB on-chip RAM for fast data access and processing
- Industrial temperature range: -40°C to +100°C (TJ) for harsh environments
- 484-FCBGA package (19x19mm) optimized for space-constrained designs
- RoHS compliant for environmental and regulatory compliance
- Active part status with long lifecycle support from AMD
- DMA and WDT peripherals for efficient data transfer and system monitoring
Ideal Applications
This MPSoC is designed for demanding applications requiring high reliability, real-time processing, and FPGA flexibility:
- Aerospace & defense systems
- Automotive ADAS and infotainment
- Industrial automation and robotics
- Medical imaging and diagnostic equipment
- Telecommunications infrastructure
- High-performance embedded computing
Why Choose AMD Zynq UltraScale+?
The Zynq UltraScale+ family delivers unmatched integration of processing power and programmable logic, enabling you to accelerate time-to-market, reduce BOM costs, and future-proof your designs with field-upgradeable FPGA fabric.
Full traceability, authorized distribution, and technical support available.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | - |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 484-BFBGA, FCBGA |
| Supplier Device Package | 484-FCBGA (19x19) |
| ROHS |

XCZU1CG-L1SBVA484I.pdf