AMD XCZU1EG-2SFVA625E

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Normaler Preis Dhs. 1,549.83
Normaler Preis Dhs. 1,631.38 Verkaufspreis Dhs. 1,549.83
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15+ Dhs. 1,500.87 Dhs. 22,513.05
25+ Dhs. 1,468.24 Dhs. 36,706.00
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100+ Dhs. 1,223.54 Dhs. 122,354.00
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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity -
Speed 533MHz, 600MHz, 1.333GHz
Primary Attributes -
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 625-BFBGA, FCBGA
Supplier Device Package 625-FCBGA (21x21)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

AMD Zynq UltraScale+ MPSoC XCZU1EG-2SFVA625E

The XCZU1EG-2SFVA625E is a high-performance System-on-Chip (SoC) from AMD's Zynq UltraScale+ family, combining multi-core ARM processing with FPGA programmable logic. This industrial-grade device delivers exceptional processing power and flexibility for embedded applications requiring real-time control, signal processing, and custom hardware acceleration.

Key Features

  • Quad-core ARM Cortex-A53 MPCore with CoreSight for application processing at 1.333 GHz
  • Dual ARM Cortex-R5 with CoreSight for real-time processing at 600 MHz
  • ARM Mali-400 MP2 GPU for graphics acceleration at 533 MHz
  • 256KB on-chip memory for low-latency data access
  • FPGA fabric for custom logic implementation and hardware acceleration
  • DMA and WDT peripherals for efficient data movement and system monitoring
  • Industrial temperature range: 0°C to 100°C (TJ)
  • 625-FCBGA package (21x21mm) for compact board designs
  • RoHS compliant for environmental compliance

Applications

Ideal for automotive ADAS, industrial automation, aerospace systems, communications infrastructure, medical imaging, and embedded vision applications requiring heterogeneous processing and programmable logic.