AMD XCZU3CG-1SBVA484I
Normaler Preis
Dhs. 1,984.71
Normaler Preis
Dhs. 2,089.14
Verkaufspreis
Dhs. 1,984.71
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 1,984.71 | Dhs. 1,984.71 |
| 15+ | Dhs. 1,922.01 | Dhs. 28,830.15 |
| 25+ | Dhs. 1,880.23 | Dhs. 47,005.75 |
| 50+ | Dhs. 1,775.77 | Dhs. 88,788.50 |
| 100+ | Dhs. 1,566.86 | Dhs. 156,686.00 |
| N+ | Dhs. 313.37 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 484-BFBGA, FCBGA |
| Supplier Device Package | 484-FCBGA (19x19) |
| ROHS |  |
AMD Zynq® UltraScale+™ MPSoC CG - XCZU3CG-1SBVA484I
The XCZU3CG-1SBVA484I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ processors with dual ARM® Cortex™-R5 processors and 154K+ FPGA logic cells. Engineered for mission-critical applications in aerospace, automotive, industrial automation, and telecom infrastructure.
Key Features
- Dual-core ARM Cortex-A53 MPCore running at 1.2GHz with CoreSight™ debug
- Dual-core ARM Cortex-R5 running at 500MHz for real-time processing
- 154K+ programmable logic cells for custom hardware acceleration
- 256KB on-chip RAM for high-speed data processing
- Industrial temperature range: -40°C to 100°C (TJ)
- Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
- RoHS compliant for environmental standards
Applications
Ideal for advanced embedded systems requiring programmable logic and processing power: motor control, industrial vision systems, aerospace avionics, automotive ADAS, 5G infrastructure, and high-reliability edge computing.
Package & Availability
Supplied in 484-pin FCBGA (19x19mm) package, tray packaging. Active production status ensures long-term availability for your design lifecycle.
XCZU3CG-1SBVA484I.pdf
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