AMD XCZU3CG-L1SFVA625I

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 2,336.53
Normaler Preis Dhs. 2,459.49 Verkaufspreis Dhs. 2,336.53
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 2,336.53 Dhs. 2,336.53
15+ Dhs. 2,262.73 Dhs. 33,940.95
25+ Dhs. 2,213.54 Dhs. 55,338.50
50+ Dhs. 2,090.57 Dhs. 104,528.50
100+ Dhs. 1,844.62 Dhs. 184,462.00
N+ Dhs. 368.92 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD Zynq UltraScale+ MPSoC XCZU3CG-L1SFVA625I

The XCZU3CG-L1SFVA625I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ processors with dual ARM® Cortex™-R5 cores and 154K+ logic cells of programmable FPGA fabric. Engineered for mission-critical applications in aerospace, automotive, industrial automation, and telecommunications infrastructure.

Key Features

  • Dual-core ARM Cortex-A53 running at 1.2GHz for application processing
  • Dual-core ARM Cortex-R5 at 500MHz for real-time control
  • 154K+ logic cells of UltraScale+ FPGA fabric for custom acceleration
  • 256KB on-chip RAM for low-latency data processing
  • Industrial temperature range: -40°C to +100°C (TJ)
  • RoHS compliant for environmental standards

Connectivity & Peripherals

Comprehensive I/O support including CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, plus DMA and watchdog timer peripherals for robust system integration.

Applications

  • Aerospace & defense embedded systems
  • Automotive ADAS and infotainment platforms
  • Industrial automation and motor control
  • 5G/telecom infrastructure equipment
  • High-reliability edge computing

Documentation: Full datasheets and technical reference manuals available from AMD.

Long-term availability: Active production status ensures reliable supply for multi-year design cycles.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 625-BFBGA, FCBGA
Supplier Device Package 625-FCBGA (21x21)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY