AMD XCZU3EG-L2SFVC784E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 3,220.23 | Dhs. 3,220.23 |
| 15+ | Dhs. 3,118.53 | Dhs. 46,777.95 |
| 25+ | Dhs. 3,050.74 | Dhs. 76,268.50 |
| 50+ | Dhs. 2,881.25 | Dhs. 144,062.50 |
| 100+ | Dhs. 2,542.28 | Dhs. 254,228.00 |
| N+ | Dhs. 508.46 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU3EG-L2SFVC784E
The XCZU3EG-L2SFVC784E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG series, combining advanced processing capabilities with FPGA flexibility for mission-critical applications in aerospace, automotive, industrial, medical, and telecommunications sectors.
Key Features
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for high-performance processing
- Dual ARM® Cortex™-R5 with CoreSight™ for real-time control
- ARM Mali™-400 MP2 graphics processing unit
- 154K+ Logic Cells FPGA fabric for custom hardware acceleration
- 256KB RAM for embedded applications
- Multi-speed operation: 533MHz, 600MHz, 1.3GHz
- Rich connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial temperature range: 0°C to 100°C (TJ)
- RoHS compliant for environmental standards
Applications
Ideal for advanced embedded systems requiring programmable logic and high-performance processing: industrial automation, automotive ADAS, medical imaging, aerospace avionics, 5G telecommunications infrastructure, and edge AI/ML acceleration.
Package & Availability
Supplied in 784-FCBGA (23x23mm) package, tray packaging. Active status with long lifecycle support for design-in confidence and supply chain continuity.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 784-BFBGA, FCBGA |
| Supplier Device Package | 784-FCBGA (23x23) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
