AMD XCZU46DR-L1FSVH1760I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 109,410.19 | Dhs. 109,410.19 |
| 15+ | Dhs. 105,955.14 | Dhs. 1,589,327.10 |
| 25+ | Dhs. 103,651.77 | Dhs. 2,591,294.25 |
| 50+ | Dhs. 97,893.34 | Dhs. 4,894,667.00 |
| 100+ | Dhs. 86,376.47 | Dhs. 8,637,647.00 |
| N+ | Dhs. 17,275.29 | Price Inquiry |
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AMD Zynq® UltraScale+™ RFSoC XCZU46DR-L1FSVH1760I
The XCZU46DR-L1FSVH1760I is a high-performance System-on-Chip (SoC) combining RF data converters with programmable logic, delivering exceptional processing power for aerospace, telecommunications, and advanced industrial applications.
Key Features
- 930K+ Logic Cells – Massive FPGA fabric for complex signal processing and custom logic implementation
- Quad ARM® Cortex®-A53 MPCore™ – High-performance 1.2GHz application processors with CoreSight™ debug
- Dual ARM® Cortex™-R5 – Real-time 500MHz processors for deterministic control and safety-critical functions
- 256KB On-Chip RAM – Fast embedded memory for low-latency data access
- Integrated RF Data Converters – Direct RF sampling eliminates external components and reduces system complexity
- Advanced Connectivity – PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range – Operates reliably from -40°C to +100°C (TJ)
- 1760-FCBGA Package – 42.5mm × 42.5mm footprint for high-density designs
Applications
Ideal for 5G wireless infrastructure, phased array radar systems, software-defined radio (SDR), test and measurement equipment, aerospace and defense systems, and high-performance embedded computing platforms requiring integrated RF processing.
Authorized Distribution & Support
We supply authentic AMD components with full manufacturer documentation, traceability certificates, and long lifecycle availability. Our technical team provides design-in support, reference designs, and application guidance to accelerate your development cycle and mitigate obsolescence risk.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ RFSoC |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
XCZU46DR-L1FSVH1760I.pdf