AMD XCZU47DR-1FFVE1156E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 56,606.83 | Dhs. 56,606.83 |
| 15+ | Dhs. 54,819.24 | Dhs. 822,288.60 |
| 25+ | Dhs. 53,627.52 | Dhs. 1,340,688.00 |
| 50+ | Dhs. 50,648.21 | Dhs. 2,532,410.50 |
| 100+ | Dhs. 44,689.60 | Dhs. 4,468,960.00 |
| N+ | Dhs. 8,937.92 | Price Inquiry |
Request Quote / Inquiry
AMD Zynq UltraScale+ RFSoC XCZU47DR-1FFVE1156E
The XCZU47DR-1FFVE1156E is a high-performance System-on-Chip (SoC) from AMD's Zynq UltraScale+ RFSoC family, combining advanced FPGA fabric with integrated RF data converters and powerful ARM processing cores. Designed for demanding applications in wireless communications, aerospace, defense, and test & measurement systems.
Key Features
- 930K+ Logic Cells – Extensive programmable logic resources for complex signal processing and custom IP integration
- Quad ARM Cortex-A53 MPCore with CoreSight – High-performance 64-bit application processing at 1.2GHz
- Dual ARM Cortex-R5 with CoreSight – Real-time processing cores at 500MHz for deterministic control tasks
- 256KB On-Chip RAM – Fast embedded memory for low-latency operations
- Integrated RF Data Converters – Direct RF sampling capability for software-defined radio and 5G applications
- Rich Connectivity – CANbus, Ethernet, USB OTG, PCIe, UART, SPI, I2C, MMC/SD/SDIO interfaces
- Industrial Temperature Range – 0°C to 100°C (TJ) for reliable operation in harsh environments
- 1156-FCBGA Package – 35x35mm footprint with advanced thermal and signal integrity
- RoHS Compliant – Meets environmental and regulatory standards
Applications
Ideal for 5G wireless infrastructure, phased array radar, electronic warfare systems, software-defined radio, test & measurement equipment, and high-speed data acquisition platforms requiring integrated RF processing and FPGA flexibility.
Documentation: Full datasheets, reference designs, and technical documentation available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ RFSoC |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |

XCZU47DR-1FFVE1156E.pdf