AMD XCZU47DR-1FSVE1156E

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AMD XCZU47DR-1FSVE1156E Zynq UltraScale+ RFSoC FPGA

The AMD XCZU47DR-1FSVE1156E is a high-performance Zynq® UltraScale+™ RFSoC (Radio Frequency System-on-Chip) that integrates advanced processing capabilities with programmable logic, making it ideal for demanding applications in wireless communications, aerospace, defense, and high-speed data acquisition systems. This device combines a quad-core ARM® Cortex®-A53 MPCore™ processor with dual ARM® Cortex™-R5 real-time processors, delivering exceptional computational power alongside 930K+ logic cells of FPGA fabric.

Key Features & Benefits

  • Integrated RF Data Converters: Eliminates external components, reducing board complexity and power consumption
  • High-Performance Processing: Quad-core ARM Cortex-A53 (1.2GHz) + Dual ARM Cortex-R5 (500MHz) processors
  • Massive Logic Capacity: 930K+ logic cells for complex FPGA designs
  • Industrial Temperature Range: 0°C to 100°C (TJ) for harsh environment reliability
  • Comprehensive Connectivity: Ethernet, USB OTG, PCIe, CAN bus, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Compact Package: 1156-ball FCBGA (35x35mm) for space-constrained designs

Target Applications

  • Software-Defined Radio (SDR) and 5G wireless infrastructure
  • Aerospace and defense radar systems
  • High-speed test and measurement equipment
  • Advanced signal processing and data acquisition
  • Mission-critical RF and mixed-signal applications

Designed for mission-critical RF and mixed-signal applications, the XCZU47DR features integrated RF data converters that eliminate the need for external components, reducing board complexity and power consumption. With support for multiple high-speed connectivity interfaces including Ethernet, USB OTG, PCIe, and CAN bus, this RFSoC provides the flexibility and performance required for next-generation software-defined radio, radar systems, test and measurement equipment, and 5G wireless infrastructure. The device operates across an industrial temperature range of 0°C to 100°C and comes in a compact 1156-ball FCBGA package (35x35mm), ensuring reliability in harsh environments.

Why Choose This RFSoC?

The XCZU47DR-1FSVE1156E delivers unmatched integration for RF applications, combining processing power, programmable logic, and RF data conversion in a single chip. This integration reduces system cost, board space, and power consumption while improving signal integrity and system performance. Backed by AMD's comprehensive development tools and long-term product availability commitment, this RFSoC is the ideal choice for your next-generation wireless, aerospace, or defense application.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ RFSoC
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
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