AMD XCZU47DR-2FSVE1156I
Normaler Preis
Dhs. 90,570.91
Normaler Preis
Dhs. 95,337.80
Verkaufspreis
Dhs. 90,570.91
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 90,570.91 | Dhs. 90,570.91 |
| 15+ | Dhs. 87,710.78 | Dhs. 1,315,661.70 |
| 25+ | Dhs. 85,804.02 | Dhs. 2,145,100.50 |
| 50+ | Dhs. 81,037.13 | Dhs. 4,051,856.50 |
| 100+ | Dhs. 71,503.35 | Dhs. 7,150,335.00 |
| N+ | Dhs. 14,300.67 | Price Inquiry |
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AMD XCZU47DR-2FSVE1156I Zynq® UltraScale+™ RFSoC FPGA
The XCZU47DR-2FSVE1156I is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ RFSoC family, combining advanced FPGA fabric with integrated RF data converters and ARM® processing subsystems. Designed for aerospace, defense, telecommunications, and high-performance computing applications requiring real-time signal processing and adaptive hardware acceleration.
Key Features & Benefits
- 930K+ Logic Cells – Massive programmable logic capacity for complex digital designs and parallel processing
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ – High-performance 64-bit application processors running at 1.333 GHz
- Dual ARM® Cortex™-R5 with CoreSight™ – Real-time processors at 533 MHz for deterministic control and safety-critical tasks
- 256KB On-Chip RAM – Low-latency memory for critical data paths
- Integrated RF Data Converters – Direct RF sampling for software-defined radio and 5G applications
- Rich Connectivity – CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range – Operates reliably from -40°C to +100°C (TJ)
- 1156-FCBGA Package (35x35mm) – High-density ball grid array for advanced PCB integration
Ideal Applications
- 5G wireless infrastructure and beamforming
- Phased array radar and electronic warfare systems
- Software-defined radio (SDR) platforms
- High-speed data acquisition and signal processing
- Aerospace and defense embedded systems
- Test and measurement instrumentation
Why Choose Our Authorized Stock?
We are an authorized distributor of AMD semiconductors, ensuring:
- ✓ 100% genuine AMD components with full manufacturer traceability
- ✓ Factory-sealed packaging with date codes and lot tracking
- ✓ Complete technical documentation and reference designs
- ✓ Long lifecycle availability to support your program timelines
- ✓ Design-in support and technical resources
Need technical support, reference designs, or volume pricing? Contact our design-in team for personalized assistance.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ RFSoC |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.333GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
XCZU47DR-2FSVE1156I.pdf
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