AMD XCZU4CG-2FBVB900E

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Normaler Preis Dhs. 6,588.70
Normaler Preis Dhs. 6,935.46 Verkaufspreis Dhs. 6,588.70
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15+ Dhs. 6,380.62 Dhs. 95,709.30
25+ Dhs. 6,241.91 Dhs. 156,047.75
50+ Dhs. 5,895.14 Dhs. 294,757.00
100+ Dhs. 5,201.60 Dhs. 520,160.00
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AMD Zynq® UltraScale+™ MPSoC CG - XCZU4CG-2FBVB900E

The XCZU4CG-2FBVB900E is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with 192K+ logic cell FPGA fabric. Engineered for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • Dual-core ARM Cortex-A53 (1.3GHz) + Dual-core ARM Cortex-R5 (533MHz) with CoreSight™ debug
  • 192K+ logic cells FPGA fabric for custom acceleration
  • 256KB on-chip RAM for low-latency processing
  • Rich connectivity: Ethernet, USB OTG, CANbus, PCIe, SPI, I2C, UART, MMC/SD/SDIO
  • Industrial temperature range: 0°C to 100°C (TJ)
  • 900-FCBGA (31x31mm) package for high-density designs
  • RoHS compliant and active production status

Applications

Ideal for advanced driver assistance systems (ADAS), industrial motor control, medical imaging, 5G wireless infrastructure, aerospace avionics, and edge AI acceleration requiring deterministic real-time processing with FPGA flexibility.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY