AMD XCZU5CG-1FBVB900E

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 7,446.70
Normaler Preis Dhs. 7,838.61 Verkaufspreis Dhs. 7,446.70
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 7,446.70 Dhs. 7,446.70
15+ Dhs. 7,211.52 Dhs. 108,172.80
25+ Dhs. 7,054.75 Dhs. 176,368.75
50+ Dhs. 6,662.82 Dhs. 333,141.00
100+ Dhs. 5,878.96 Dhs. 587,896.00
N+ Dhs. 1,175.79 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

AMD Zynq® UltraScale+™ MPSoC CG - XCZU5CG-1FBVB900E

The XCZU5CG-1FBVB900E is a high-performance System-on-Chip (SoC) combining FPGA fabric with dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors, delivering exceptional processing power and flexibility for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features & Benefits

  • Dual-Core Processing: ARM Cortex-A53 (1.2GHz) + ARM Cortex-R5 (500MHz) with CoreSight™ debug
  • 256K+ Logic Cells: Extensive FPGA resources for complex digital designs
  • 256KB On-Chip RAM: High-speed embedded memory for data-intensive operations
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO interfaces
  • Industrial-Grade Reliability: 0°C to 100°C junction temperature, active production status
  • RoHS Compliant: Environmentally responsible, meets global regulatory standards
  • Compact 900-FCBGA Package: 31x31mm footprint for space-constrained designs

Ideal Applications

Perfect for advanced embedded systems requiring real-time processing, hardware acceleration, and long lifecycle support including aerospace flight control, automotive ADAS, industrial robotics, medical imaging, and 5G telecommunications infrastructure.

Authorized Distributor: Full traceability, genuine AMD components, long lifecycle availability, and technical support for design-in confidence.