AMD XCZU5CG-1FBVB900I

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Normaler Preis Dhs. 9,310.46
Normaler Preis Dhs. 9,800.48 Verkaufspreis Dhs. 9,310.46
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1 Dhs. 9,310.46 Dhs. 9,310.46
15+ Dhs. 9,016.44 Dhs. 135,246.60
25+ Dhs. 8,820.43 Dhs. 220,510.75
50+ Dhs. 8,330.41 Dhs. 416,520.50
100+ Dhs. 7,350.36 Dhs. 735,036.00
N+ Dhs. 1,470.07 Price Inquiry
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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

AMD Zynq® UltraScale+™ MPSoC CG - XCZU5CG-1FBVB900I

The XCZU5CG-1FBVB900I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with advanced FPGA fabric, delivering exceptional processing power and flexibility for aerospace, automotive, industrial automation, and telecom infrastructure applications.

Key Features

  • Dual-core ARM Cortex-A53 MPCore running at 1.2GHz with CoreSight™ debug
  • Dual-core ARM Cortex-R5 running at 500MHz for real-time processing
  • 256K+ logic cells FPGA fabric for custom hardware acceleration
  • 256KB on-chip RAM for high-speed data processing
  • Industrial temperature range: -40°C to 100°C (TJ)
  • RoHS compliant for environmental standards
  • Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
  • 900-FCBGA package (31x31mm) for high-density integration

Applications

Ideal for mission-critical systems requiring deterministic real-time performance, hardware acceleration, and long-term availability including industrial controllers, automotive ADAS, aerospace avionics, 5G infrastructure, and embedded vision systems.