AMD XCZU5CG-2FBVB900E

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Normaler Preis Dhs. 10,428.21
Normaler Preis Dhs. 10,977.07 Verkaufspreis Dhs. 10,428.21
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1 Dhs. 10,428.21 Dhs. 10,428.21
15+ Dhs. 10,098.90 Dhs. 151,483.50
25+ Dhs. 9,879.36 Dhs. 246,984.00
50+ Dhs. 9,330.51 Dhs. 466,525.50
100+ Dhs. 8,232.80 Dhs. 823,280.00
N+ Dhs. 1,646.56 Price Inquiry
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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

AMD XCZU5CG-2FBVB900E Zynq UltraScale+ MPSoC CG FPGA

The AMD XCZU5CG-2FBVB900E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, engineered for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features & Benefits

  • Dual-Core Processing: Dual ARM® Cortex®-A53 MPCore™ (1.3GHz) and Dual ARM® Cortex™-R5 (533MHz) with CoreSight™ for real-time processing and debugging
  • Massive Logic Capacity: 256K+ logic cells with Zynq® UltraScale+™ FPGA architecture for complex, scalable designs
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO for versatile system integration
  • Industrial-Grade Reliability: Operating temperature 0°C to 100°C (TJ), active part status, RoHS compliant
  • Compact High-Density Package: 900-FCBGA (31x31mm) for space-constrained applications

Ideal Applications

Perfect for advanced embedded systems requiring high computational power, real-time processing, and FPGA flexibility including industrial control systems, automotive ADAS, medical imaging equipment, aerospace avionics, and 5G telecommunications infrastructure.