AMD XCZU5EG-3FBVB900E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 15,930.86 | Dhs. 15,930.86 |
| 15+ | Dhs. 15,427.77 | Dhs. 231,416.55 |
| 25+ | Dhs. 15,092.39 | Dhs. 377,309.75 |
| 50+ | Dhs. 14,253.92 | Dhs. 712,696.00 |
| 100+ | Dhs. 12,576.99 | Dhs. 1,257,699.00 |
| N+ | Dhs. 2,515.40 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU5EG-3FBVB900E
The XCZU5EG-3FBVB900E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, ideal for aerospace, automotive, industrial automation, and telecommunications applications requiring real-time processing and adaptable hardware acceleration.
Key Features
- Dual Processing Architecture: Quad ARM® Cortex®-A53 MPCore™ (1.5GHz) + Dual ARM® Cortex™-R5 (600MHz) with CoreSight™ debug
- High-Density FPGA: 256K+ logic cells for custom hardware acceleration and signal processing
- Rich Connectivity: Ethernet, USB OTG, CANbus, PCIe, SPI, I2C, UART, MMC/SD/SDIO interfaces
- Industrial Grade: 0°C to 100°C junction temperature range, active production status
- Compact Package: 900-pin FCBGA (31x31mm) for space-constrained designs
- RoHS Compliant: Meets environmental standards for global markets
Applications
Designed for embedded vision systems, software-defined radio, motor control, industrial IoT gateways, avionics, and high-performance edge computing platforms requiring deterministic real-time performance with FPGA flexibility.
Sourcing & Documentation
All units sourced from authorized AMD distributors with full traceability. Complete datasheets, reference designs, and technical documentation available. Long-term availability commitment for production designs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
