AMD XCZU5EG-L2FBVB900E

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 13,075.05
Normaler Preis Dhs. 13,763.22 Verkaufspreis Dhs. 13,075.05
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 13,075.05 Dhs. 13,075.05
15+ Dhs. 12,662.16 Dhs. 189,932.40
25+ Dhs. 12,386.90 Dhs. 309,672.50
50+ Dhs. 11,698.74 Dhs. 584,937.00
100+ Dhs. 10,322.42 Dhs. 1,032,242.00
N+ Dhs. 2,064.48 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD Zynq® UltraScale+™ MPSoC EG XCZU5EG-L2FBVB900E

The AMD XCZU5EG-L2FBVB900E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, ideal for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • Heterogeneous Processing: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz), Dual ARM® Cortex™-R5 (600MHz), and ARM Mali™-400 MP2 GPU
  • Programmable Logic: 256K+ logic cells with Zynq® UltraScale+™ FPGA architecture
  • Memory: 256KB on-chip RAM for high-speed data processing
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
  • Industrial Grade: Operating temperature 0°C to 100°C (TJ)
  • Compact Package: 900-FCBGA (31x31mm) for space-constrained designs
  • RoHS Compliant: Environmentally responsible manufacturing

Applications

This versatile MPSoC is engineered for demanding applications requiring real-time processing, hardware acceleration, and system integration:

  • Aerospace and defense systems
  • Automotive ADAS and autonomous driving
  • Industrial automation and robotics
  • Medical imaging and diagnostic equipment
  • 5G telecommunications infrastructure
  • High-performance embedded computing

Why Choose AMD Zynq UltraScale+?

The Zynq UltraScale+ architecture delivers unmatched flexibility by combining software programmability with hardware acceleration. Design engineers benefit from reduced development time, lower power consumption, and the ability to adapt to evolving requirements through FPGA reconfiguration.

Note: This part is marked as "Not For New Designs." Please contact us for recommended alternatives or lifecycle support options for existing designs.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Not For New Designs
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.