AMD XCZU6CG-2FFVC900E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 11,824.96 | Dhs. 11,824.96 |
| 15+ | Dhs. 11,451.53 | Dhs. 171,772.95 |
| 25+ | Dhs. 11,202.58 | Dhs. 280,064.50 |
| 50+ | Dhs. 10,580.21 | Dhs. 529,010.50 |
| 100+ | Dhs. 9,335.48 | Dhs. 933,548.00 |
| N+ | Dhs. 1,867.10 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC CG - XCZU6CG-2FFVC900E
The XCZU6CG-2FFVC900E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, designed for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features
- Dual ARM® Cortex®-A53 MPCore™ processors running at 1.3GHz with CoreSight™ debug
- Dual ARM® Cortex™-R5 real-time processors with CoreSight™ for deterministic control
- 469K+ Logic Cells FPGA fabric for custom hardware acceleration
- 256KB On-Chip RAM for high-speed data processing
- 533MHz Processing Speed for FPGA operations
Connectivity & Peripherals
Comprehensive I/O support including CANbus, Gigabit Ethernet, USB OTG, SPI, I²C, UART/USART, and MMC/SD/SDIO interfaces. Integrated DMA and Watchdog Timer (WDT) for robust system operation.
Industrial-Grade Reliability
Operating temperature range: 0°C to 100°C (TJ), making it suitable for harsh industrial environments. RoHS compliant for environmental safety and regulatory compliance.
Package & Form Factor
Supplied in 900-FCBGA (31x31mm) package for high-density PCB integration. Active production status ensures long-term availability for critical designs.
Applications
- Aerospace & Defense Systems
- Automotive ADAS & Infotainment
- Industrial Automation & Robotics
- Medical Imaging & Diagnostics
- 5G Telecommunications Infrastructure
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
XCZU6CG-2FFVC900E.pdf