AMD XCZU6CG-L2FFVC900E

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Normaler Preis Dhs. 13,515.51
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AMD Zynq® UltraScale+™ MPSoC CG - XCZU6CG-L2FFVC900E

The XCZU6CG-L2FFVC900E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC CG series, combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with advanced FPGA fabric featuring 469K+ logic cells. This industrial-grade device is engineered for mission-critical applications in aerospace, automotive, industrial automation, medical equipment, and telecommunications.

Key Features & Benefits

  • Dual Processing Architecture: ARM Cortex-A53 MPCore (1.3GHz) for application processing + ARM Cortex-R5 (533MHz) for real-time control with CoreSight™ debug
  • Massive FPGA Resources: 469K+ logic cells enable complex custom logic, signal processing, and hardware acceleration
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO for versatile system integration
  • Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in harsh environments
  • Compact High-Density Package: 900-pin FCBGA (31x31mm) for space-constrained designs
  • RoHS Compliant: Meets environmental and regulatory standards for global deployment

Ideal Applications

This SoC is perfectly suited for advanced embedded systems requiring both high-performance processing and customizable hardware acceleration: aerospace flight control systems, automotive ADAS and autonomous driving platforms, industrial robotics and machine vision, medical imaging and diagnostic equipment, 5G/telecommunications infrastructure, and defense/security systems.

Documentation: AMD Zynq UltraScale+ Technical Reference

Authorized distributor • Full traceability • RoHS/REACH compliant • Long lifecycle support for critical designs

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY