AMD XCZU7CG-1FBVB900I

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Normaler Preis Dhs. 11,531.54
Normaler Preis Dhs. 12,138.46 Verkaufspreis Dhs. 11,531.54
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Quantity Unit Price Total Price
1 Dhs. 11,531.54 Dhs. 11,531.54
15+ Dhs. 11,167.38 Dhs. 167,510.70
25+ Dhs. 10,924.61 Dhs. 273,115.25
50+ Dhs. 10,317.69 Dhs. 515,884.50
100+ Dhs. 9,103.85 Dhs. 910,385.00
N+ Dhs. 1,820.77 Price Inquiry
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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

AMD XCZU7CG-1FBVB900I - Zynq UltraScale+ MPSoC CG FPGA

The XCZU7CG-1FBVB900I is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, designed for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • Dual-Core Processing: ARM Cortex-A53 MPCore (1.2GHz) + ARM Cortex-R5 with CoreSight for real-time control
  • Massive Logic Capacity: 504K+ logic cells for complex FPGA designs
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO
  • 256KB On-Chip RAM with DMA and watchdog timer peripherals
  • Compact 900-FCBGA Package: 31x31mm footprint
  • RoHS Compliant: Environmentally responsible design

Ideal Applications

This Zynq UltraScale+ device excels in applications requiring high-speed processing, programmable logic, and long lifecycle support including advanced driver assistance systems (ADAS), industrial robotics, medical imaging, 5G infrastructure, and aerospace avionics.