AMD XCZU7CG-L1FFVC1156I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 14,334.09 | Dhs. 14,334.09 |
| 15+ | Dhs. 13,881.42 | Dhs. 208,221.30 |
| 25+ | Dhs. 13,579.65 | Dhs. 339,491.25 |
| 50+ | Dhs. 12,825.23 | Dhs. 641,261.50 |
| 100+ | Dhs. 11,316.38 | Dhs. 1,131,638.00 |
| N+ | Dhs. 2,263.28 | Price Inquiry |
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AMD Zynq UltraScale+ MPSoC XCZU7CG-L1FFVC1156I
The XCZU7CG-L1FFVC1156I is a high-performance System-on-Chip (SoC) from AMD's Zynq UltraScale+ MPSoC CG series, combining dual ARM Cortex-A53 MPCore and dual ARM Cortex-R5 processors with advanced FPGA fabric featuring over 504,000 logic cells. This industrial-grade device is engineered for mission-critical applications in aerospace, automotive, industrial automation, and telecommunications.
Key Features
- Dual-core ARM Cortex-A53 MPCore with CoreSight - High-performance application processing at 1.2GHz
- Dual-core ARM Cortex-R5 with CoreSight - Real-time processing at 500MHz for deterministic control
- 504K+ Logic Cells - Extensive FPGA fabric for custom hardware acceleration
- 256KB RAM - Integrated on-chip memory for low-latency operations
- Comprehensive Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
- Industrial Temperature Range - Qualified for -40°C to 100°C (TJ) operation
- 1156-FCBGA Package - Compact 35x35mm footprint for space-constrained designs
- RoHS Compliant - Meets environmental standards for global deployment
Applications
Ideal for advanced embedded systems requiring heterogeneous processing, hardware acceleration, and real-time control including industrial robotics, automotive ADAS, aerospace avionics, 5G infrastructure, medical imaging, and high-performance edge computing.
Documentation & Support
Full datasheet and technical documentation available from AMD. This device is sourced from authorized distributors with complete traceability and manufacturer documentation.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
XCZU7CG-L1FFVC1156I.pdf