AMD XCZU7EG-2FBVB900E

Zu Produktinformationen springen
1 von 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Normaler Preis Dhs. 13,844.70
Normaler Preis Dhs. 14,573.37 Verkaufspreis Dhs. 13,844.70
Sale Ausverkauft
Quantity Unit Price Total Price
1 Dhs. 13,844.70 Dhs. 13,844.70
15+ Dhs. 13,407.50 Dhs. 201,112.50
25+ Dhs. 13,116.03 Dhs. 327,900.75
50+ Dhs. 12,387.36 Dhs. 619,368.00
100+ Dhs. 10,930.03 Dhs. 1,093,003.00
N+ Dhs. 2,186.01 Price Inquiry
Versand wird beim Checkout berechnet
Anzahl
Component Recycling

Request Quote / Inquiry

AMD Zynq® UltraScale+™ MPSoC EG - XCZU7EG-2FBVB900E

The XCZU7EG-2FBVB900E is a high-performance System-on-Chip (SoC) combining FPGA fabric with embedded processing, ideal for aerospace, automotive, industrial, medical, and telecom applications requiring adaptive computing and real-time processing.

Key Features

  • 504K+ Logic Cells - Extensive FPGA resources for complex designs
  • Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - High-performance application processing at 1.3GHz
  • Dual ARM® Cortex™-R5 with CoreSight™ - Real-time processing at 533MHz/600MHz
  • ARM Mali™-400 MP2 GPU - Graphics and video processing
  • 256KB On-Chip RAM - Fast embedded memory
  • Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO
  • 900-FCBGA Package (31x31mm) - Compact form factor for space-constrained designs
  • RoHS Compliant - Meets environmental standards

Applications

This MPSoC is engineered for mission-critical systems requiring long lifecycle support, including advanced driver assistance systems (ADAS), industrial automation, medical imaging, 5G infrastructure, and aerospace/defense platforms.

Quality & Compliance

Sourced from authorized channels with full manufacturer traceability. All units include original documentation and comply with RoHS/REACH regulations for global deployment.

Complete Specifications

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.