AMD XCZU9CG-2FFVC900I

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Normaler Preis Dhs. 16,601.57
Normaler Preis Dhs. 17,475.33 Verkaufspreis Dhs. 16,601.57
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25+ Dhs. 15,727.80 Dhs. 393,195.00
50+ Dhs. 14,854.03 Dhs. 742,701.50
100+ Dhs. 13,106.50 Dhs. 1,310,650.00
N+ Dhs. 2,621.30 Price Inquiry
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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)

AMD XCZU9CG-2FFVC900I - Zynq UltraScale+ MPSoC FPGA

The AMD XCZU9CG-2FFVC900I is a high-performance System-on-Chip (SoC) combining programmable logic with processing power. This Zynq® UltraScale+™ MPSoC CG device features dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with CoreSight™, delivering exceptional performance for embedded applications requiring both FPGA flexibility and processor capability.

Key Features:

  • 599K+ Logic Cells - Extensive FPGA resources for complex designs
  • Dual-Core Processing - ARM Cortex-A53 (1.3GHz) + ARM Cortex-R5 (533MHz) architecture
  • 256KB On-Chip RAM - Fast memory for critical operations
  • Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • 900-FCBGA Package - Compact 31x31mm form factor

Applications:

Ideal for automotive systems, industrial automation, aerospace & defense, medical imaging, 5G wireless infrastructure, machine vision, and advanced embedded computing applications requiring high-performance processing with FPGA acceleration.

Technical Specifications:

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