AMD XCZU9EG-3FFVC900E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 21,917.44 | Dhs. 21,917.44 |
| 15+ | Dhs. 21,225.32 | Dhs. 318,379.80 |
| 25+ | Dhs. 20,763.90 | Dhs. 519,097.50 |
| 50+ | Dhs. 19,610.35 | Dhs. 980,517.50 |
| 100+ | Dhs. 17,303.25 | Dhs. 1,730,325.00 |
| N+ | Dhs. 3,460.65 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
AMD Zynq® UltraScale+™ MPSoC EG - High-Density FPGA Solution
The XCZU9EG-3FFVC900E is an industrial-grade, high-performance system-on-chip (SoC) combining programmable logic with embedded processing. Engineered for aerospace, automotive, industrial automation, and telecommunications applications requiring long lifecycle support and proven reliability.
Key Features
- 599K+ Logic Cells - Extensive programmable fabric for complex digital designs
- Quad ARM® Cortex®-A53 MPCore™ - High-performance 1.5GHz application processing with CoreSight™ debug
- Dual ARM® Cortex™-R5 - Real-time 600MHz processing for deterministic control with CoreSight™
- 256KB On-Chip RAM - Fast embedded memory for critical data paths
- Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range - Qualified for 0°C to 100°C junction temperature operation
- RoHS Compliant - Meets environmental and regulatory standards for global markets
Applications
Ideal for advanced driver assistance systems (ADAS), industrial machine vision, 5G wireless infrastructure, avionics, medical imaging, test & measurement equipment, and mission-critical embedded systems requiring traceable sourcing and long-term availability.
Package & Availability
Supplied in tray packaging with 900-pin FCBGA (31x31mm) footprint. Active production status with full manufacturer documentation and authorized distributor traceability.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
