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NXP USA Inc.

MCZ33905BD3EK

MCZ33905BD3EK

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Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series
Packaging |
Applications System Basis Chip
Interface CAN, LIN
Voltage - Supply 5.5V ~ 28V
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 54-SOIC-EP
ROHS

Datasheets:     MCZ33905BD3EK .pdf

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