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Microsemi Corporation
AFS090-2FG256
AFS090-2FG256
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 203.38 AED | Dhs. 203.38 AED |
| 15+ | Dhs. 196.96 AED | Dhs. 2,954.40 AED |
| 25+ | Dhs. 192.68 AED | Dhs. 4,817.00 AED |
| 50+ | Dhs. 181.98 AED | Dhs. 9,099.00 AED |
| 100+ | Dhs. 160.57 AED | Dhs. 16,057.00 AED |
| N+ | Dhs. 32.11 AED | Price Inquiry |
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Microsemi AFS090-2FG256 Fusion® FPGA - High-Performance Programmable Logic Solution
The AFS090-2FG256 from Microsemi Corporation delivers reliable, field-programmable gate array (FPGA) performance for demanding industrial, aerospace, automotive, telecommunications, and embedded applications. Part of the proven Fusion® family, this FPGA combines 90,000 gates with integrated mixed-signal capabilities, making it ideal for system designers requiring both digital logic and analog functionality in a single, compact device.
Key Features & Benefits
- 90,000 Logic Gates - Ample programmable logic resources for complex digital designs
- 75 I/O Pins - Flexible connectivity for interfacing with sensors, controllers, and communication buses
- 27,648 RAM Bits - Embedded memory for data buffering, lookup tables, and state machines
- 256-FBGA Package (17x17mm) - Space-efficient surface mount footprint for high-density PCB layouts
- Industrial Temperature Range (0°C to 85°C TJ) - Proven reliability across harsh operating environments
- 1.425V to 1.575V Supply Voltage - Low-power operation for energy-sensitive applications
- Long Lifecycle Support - Microsemi commitment to extended product availability and traceability
Ideal Applications
This FPGA is well-suited for motor control, sensor interfacing, industrial automation, medical instrumentation, avionics, automotive electronics, and mixed-signal processing where both programmable logic and analog I/O are required.
Why Choose Microsemi Fusion FPGAs?
Microsemi's Fusion family integrates FPGA fabric with analog functions, reducing component count, board space, and system cost. With comprehensive development tools, reference designs, and application notes, engineers can accelerate time-to-market while maintaining full compliance with RoHS and REACH standards.
Complete Technical Specifications
| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | Fusion® |
| Packaging | Tray | Tray |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 27648 |
| Number of I/O | 75 |
| Number of Gates | 90000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
Compliance: RoHS compliant | REACH compliant | Full traceability documentation available
Availability: In stock with same-day shipping. Volume pricing and custom tape-and-reel packaging available upon request.
Datasheets:
AFS090-2FG256
.pdf
