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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Broadcom Limited
BCM3380DIFSBG
BCM3380DIFSBG
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,880.72 AED | Dhs. 355,880.72 AED |
| 15+ | Dhs. 344,642.38 AED | Dhs. 5,169,635.70 AED |
| 25+ | Dhs. 337,150.15 AED | Dhs. 8,428,753.75 AED |
| 50+ | Dhs. 318,419.59 AED | Dhs. 15,920,979.50 AED |
| 100+ | Dhs. 280,958.46 AED | Dhs. 28,095,846.00 AED |
| N+ | Dhs. 56,191.69 AED | Price Inquiry |
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Broadcom BCM3380DIFSBG - DOCSIS 3.0 Data Modem SoC
The BCM3380DIFSBG is a high-performance System-on-Chip (SoC) designed by Broadcom Limited for DOCSIS 3.0 cable data modem applications. This industrial-temperature grade semiconductor component delivers reliable connectivity solutions for demanding environments.
Key Features
- DOCSIS 3.0 compliant data modem functionality
- Industrial temperature range operation
- Integrated System-on-Chip architecture
- Manufactured by Broadcom Limited, a leading semiconductor innovator
- Part Number: BCM3380DIFSBG
Applications
Ideal for cable modem systems, broadband communication equipment, and industrial networking applications requiring extended temperature operation and DOCSIS 3.0 compliance.
Technical Specifications
| Product attributes | Property Value |
| Manufacturer | Broadcom Limited |
| Product Series | |
| Packaging | | |
| Part Status | Obsolete |
| Architecture | - |
| Core Processor | - |
| Flash Size | - |
| RAM Size | - |
| Peripherals | - |
| Connectivity | - |
| Speed | - |
| Primary Attributes | - |
| Operating Temperature | - |
| Grade | - |
| Qualification | - |
| Package / Case | - |
| Supplier Device Package | - |
Availability Notice
Part Status: Obsolete - This component is no longer in active production. Contact us for availability, alternative solutions, or last-time-buy opportunities.
Why Choose This Component?
As an authorized distributor specializing in long lifecycle support and component traceability, we provide comprehensive technical documentation, design-in resources, and global shipping for aerospace, automotive, industrial, telecommunications, and medical applications.
