-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Microsemi Corporation
M2S090-1FG676IX417
M2S090-1FG676IX417
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 750.23 AED | Dhs. 750.23 AED |
| 15+ | Dhs. 726.54 AED | Dhs. 10,898.10 AED |
| 25+ | Dhs. 710.75 AED | Dhs. 17,768.75 AED |
| 50+ | Dhs. 671.26 AED | Dhs. 33,563.00 AED |
| 100+ | Dhs. 592.29 AED | Dhs. 59,229.00 AED |
| N+ | Dhs. 118.46 AED | Price Inquiry |
Impossible de charger la disponibilité du service de retrait
Apply for PCBA engineering assistance
Microsemi SmartFusion2 M2S090-1FG676IX417 SoC FPGA
The M2S090-1FG676IX417 is a high-performance System-on-Chip (SoC) FPGA from Microsemi's SmartFusion®2 family, combining an ARM® Cortex®-M3 processor with 90,000 logic modules for demanding aerospace, automotive, industrial automation, and telecom infrastructure applications.
Key Features
- Dual Architecture: ARM Cortex-M3 MCU + 90K logic module FPGA for flexible system design
- High-Speed Processing: 166MHz operation with 512KB Flash and 64KB RAM
- Advanced Connectivity: DDR, PCIe, SERDES, CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
- Compact 676-FBGA Package: 27x27mm footprint for space-constrained designs
Ideal Applications
This SoC FPGA excels in applications requiring programmable logic, embedded processing, and robust peripheral integration—perfect for motor control, industrial networking, secure communications, and real-time data acquisition systems.
Complete Technical Specifications
| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | SmartFusion®2 |
| Packaging | Bag | |
| Part Status | Obsolete |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 90K Logic Modules |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
Note: This component is marked as obsolete. Please verify availability and consider lifecycle planning for long-term projects.
Datasheets:
M2S090-1FG676IX417
.pdf
