-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
AMD
XCVC1702-1LLIVSVA2197
XCVC1702-1LLIVSVA2197
Prix habituel
Dhs. 132,406.29
Prix habituel
Dhs. 139,375.02
Prix promotionnel
Dhs. 132,406.29
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 132,406.29 AED | Dhs. 132,406.29 AED |
| 15+ | Dhs. 128,225.02 AED | Dhs. 1,923,375.30 AED |
| 25+ | Dhs. 125,437.52 AED | Dhs. 3,135,938.00 AED |
| 50+ | Dhs. 118,468.77 AED | Dhs. 5,923,438.50 AED |
| 100+ | Dhs. 104,531.27 AED | Dhs. 10,453,127.00 AED |
| N+ | Dhs. 20,906.25 AED | Price Inquiry |
Frais d'expédition calculés à l'étape de paiement.
Quantité
Impossible de charger la disponibilité du service de retrait
Apply for PCBA engineering assistance
AMD Versal™ AI Core XCVC1702-1LLIVSVA2197 FPGA
High-performance System-on-Chip (SoC) FPGA combining adaptive computing with embedded processing for industrial, automotive, aerospace, communications, and edge computing applications.
Key Features
- 1 Million Logic Cells - Extensive programmable fabric for complex designs
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance application processing at 1GHz
- Dual ARM® Cortex™-R5F with CoreSight™ - Real-time processing at 400MHz
- Advanced Connectivity - DDR, DMA, PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
- Compact 2197-FCBGA Package - 45x45mm form factor for space-constrained designs
Applications
Ideal for AI/ML acceleration, 5G wireless infrastructure, automotive ADAS systems, aerospace avionics, industrial automation, edge computing platforms, and high-speed data acquisition systems requiring adaptive hardware acceleration.
Technical Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
Authenticity Guaranteed - All components sourced directly from authorized distributors with full traceability and manufacturer documentation.
Datasheets:
XCVC1702-1LLIVSVA2197
.pdf
×
