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AMD
XCVC1702-1LSENSVG1369
XCVC1702-1LSENSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 71,924.33 AED | Dhs. 71,924.33 AED |
| 15+ | Dhs. 69,653.04 AED | Dhs. 1,044,795.60 AED |
| 25+ | Dhs. 68,138.85 AED | Dhs. 1,703,471.25 AED |
| 50+ | Dhs. 64,353.36 AED | Dhs. 3,217,668.00 AED |
| 100+ | Dhs. 56,782.37 AED | Dhs. 5,678,237.00 AED |
| N+ | Dhs. 11,356.47 AED | Price Inquiry |
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AMD Versal AI Core FPGA - XCVC1702-1LSENSVG1369
The AMD Versal AI Core XCVC1702 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing and AI acceleration capabilities. Engineered for demanding industrial, automotive, aerospace, and edge computing applications, this System-on-Chip delivers unparalleled flexibility and performance.
Key Features & Benefits
- 1 Million Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM Cortex-A72 MPCore - High-performance 1GHz application processors with CoreSight debug
- Dual ARM Cortex-R5F - Real-time 400MHz processors for deterministic control
- Advanced Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART interfaces
- Industrial Temperature Range - Reliable operation from 0°C to 100°C (TJ)
- Compact 1369-FCBGA Package - Space-efficient 35x35mm footprint for high-density designs
Ideal Applications
Perfect for AI/ML inference acceleration, software-defined radio, 5G wireless infrastructure, autonomous vehicle systems, industrial automation, aerospace avionics, high-speed data acquisition, and edge computing platforms requiring adaptive hardware acceleration.
Complete Technical Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
Backed by AMD's industry-leading support and comprehensive development tools including Vivado Design Suite and Vitis AI framework.
Datasheets:
XCVC1702-1LSENSVG1369
.pdf
