-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
AMD
XCVC1902-2HSIVSVA2197
XCVC1902-2HSIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 158,814.58 AED | Dhs. 158,814.58 AED |
| 15+ | Dhs. 153,799.37 AED | Dhs. 2,306,990.55 AED |
| 25+ | Dhs. 150,455.91 AED | Dhs. 3,761,397.75 AED |
| 50+ | Dhs. 142,097.25 AED | Dhs. 7,104,862.50 AED |
| 100+ | Dhs. 125,379.92 AED | Dhs. 12,537,992.00 AED |
| N+ | Dhs. 25,075.98 AED | Price Inquiry |
Impossible de charger la disponibilité du service de retrait
Apply for PCBA engineering assistance
AMD Versal™ AI Core XCVC1902-2HSIVSVA2197 FPGA System-on-Chip
The AMD Versal AI Core XCVC1902-2HSIVSVA2197 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing subsystems for demanding industrial, automotive, aerospace, communications, and edge computing applications.
Key Features
- 1.9 Million Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM® Cortex®-A72 MPCore™ - High-performance 1.65GHz application processors with CoreSight™ debug
- Dual ARM® Cortex™-R5F - Real-time 800MHz processors with CoreSight™ for deterministic control
- 256KB On-Chip RAM - Fast embedded memory for critical data paths
- Industrial Temperature Range - Qualified for -40°C to 100°C (TJ) operation
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART/USART, MMC/SD/SDIO
- 2197-FCBGA Package - Compact 45x45mm flip-chip ball grid array for high-density designs
Applications
Ideal for advanced embedded systems requiring adaptive hardware acceleration, real-time processing, and high-speed connectivity including 5G infrastructure, autonomous vehicles, industrial automation, aerospace/defense systems, and AI/ML edge inference.
Technical Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz, 1.65GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
Why Choose This FPGA?
This Versal AI Core device delivers unmatched flexibility and performance for next-generation embedded systems. The heterogeneous architecture combines programmable logic, scalar processing engines, and intelligent engines optimized for compute-intensive workloads, enabling you to adapt your hardware to evolving requirements without board redesigns.
Authentic AMD product with full manufacturer warranty and technical documentation support.
Datasheets:
XCVC1902-2HSIVSVA2197
.pdf
