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Microsemi Corporation

A2F060M3E-FGG256

A2F060M3E-FGG256

通常価格 Dhs. 66.94
通常価格 Dhs. 70.46 セール価格 Dhs. 66.94
セール 売り切れ
Quantity Unit Price Total Price
1 Dhs. 66.94 AED Dhs. 66.94 AED
15+ Dhs. 64.82 AED Dhs. 972.30 AED
25+ Dhs. 63.41 AED Dhs. 1,585.25 AED
50+ Dhs. 59.89 AED Dhs. 2,994.50 AED
100+ Dhs. 52.85 AED Dhs. 5,285.00 AED
N+ Dhs. 10.57 AED Price Inquiry
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Microsemi A2F060M3E-FGG256 SmartFusion® System-on-Chip (SoC)

The A2F060M3E-FGG256 is a high-performance mixed-signal System-on-Chip (SoC) from Microsemi's SmartFusion® family, integrating an ARM® Cortex®-M3 microcontroller core with a ProASIC®3 FPGA fabric (60K gates, 1536 D-Flip-Flops). This unique architecture delivers the flexibility of programmable logic with the deterministic performance of a hard processor, making it ideal for aerospace, industrial control, medical devices, and secure embedded applications.

Key Features & Benefits

  • Dual Architecture: ARM Cortex-M3 MCU + ProASIC3 FPGA for maximum design flexibility
  • High Performance: 80MHz processor speed with 128KB Flash and 16KB RAM
  • Rich Connectivity: EBI/EMI, I²C, SPI, UART/USART interfaces
  • Integrated Peripherals: DMA, Power-On Reset (POR), Watchdog Timer (WDT)
  • Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation
  • Compact Package: 256-pin Fine-Pitch BGA (17x17mm) for space-constrained designs

Typical Applications

  • Motor control and industrial automation
  • Medical instrumentation and diagnostics
  • Aerospace and defense systems
  • Secure communications and cryptography
  • High-reliability embedded systems

Design Support & Resources

Full technical documentation, reference designs, and datasheets available. Our engineering team provides design-in support to accelerate your time-to-market.

Complete Technical Specifications

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray |
Part Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

Note: This product is marked as obsolete. Please contact our team for availability, last-time-buy opportunities, or recommended alternatives.

Quality & Compliance

All components ship with full traceability documentation and comply with RoHS/REACH regulations. Authorized distributor with manufacturer-backed warranty.

Datasheets:     A2F060M3E-FGG256 .pdf

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