A2F060M3E-FGG256M

Name: A2F060M3E-FGG256M
Brand: Microsemi Corporation
SKU: A2F060M3E-FGG256M
Price: 809.38 AED
Availability: InStock

Dhs. 809.38

~~Dhs. 851.98~~ Dhs. 809.38

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Quantity	Unit Price	Total Price
1	Dhs. 809.38 AED	Dhs. 809.38 AED
15+	Dhs. 783.82 AED	Dhs. 11,757.30 AED
25+	Dhs. 766.78 AED	Dhs. 19,169.50 AED
50+	Dhs. 724.18 AED	Dhs. 36,209.00 AED
100+	Dhs. 638.99 AED	Dhs. 63,899.00 AED
N+	Dhs. 127.80 AED	Price Inquiry

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Microsemi A2F060M3E-FGG256M SmartFusion® System-on-Chip

The A2F060M3E-FGG256M is a high-performance SmartFusion® mixed-signal system-on-chip (SoC) combining an ARM® Cortex®-M3 microcontroller with ProASIC®3 FPGA fabric. Designed for industrial, automotive, aerospace, and communications applications requiring programmable logic with embedded processing.

Key Features

ARM Cortex-M3 Core: 80MHz processor with 128KB Flash and 16KB RAM
FPGA Fabric: 60K gates ProASIC®3 with 1,536 D-flip-flops for custom logic
Extended Temperature: -55°C to 125°C (TJ) for harsh environments
Rich Connectivity: I2C, SPI, UART/USART, EBI/EMI interfaces
Integrated Peripherals: DMA, POR, WDT for system reliability
Compact Package: 256-FPBGA (17x17mm) footprint

Applications

Ideal for motor control, sensor fusion, industrial automation, avionics, secure communications, and mixed-signal processing where FPGA flexibility meets MCU integration.

Complete Technical Specifications

Product attributes	Property Value
Manufacturer	Microsemi Corporation
Product Series	SmartFusion®
Packaging	Tray \| Tray
Architecture	MCU, FPGA
Core Processor	ARM® Cortex®-M3
Flash Size	128KB
RAM Size	16KB
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, I2C, SPI, UART/USART
Speed	80MHz
Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature	-55°C ~ 125°C (TJ)
Grade	-
Qualification	-
Package / Case	256-LBGA
Supplier Device Package	256-FPBGA (17x17)