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Microsemi Corporation

M1A3P600L-1FGG256I

M1A3P600L-1FGG256I

通常価格 Dhs. 345.92
通常価格 Dhs. 364.12 セール価格 Dhs. 345.92
セール 売り切れ
Quantity Unit Price Total Price
1 Dhs. 345.92 AED Dhs. 345.92 AED
15+ Dhs. 334.99 AED Dhs. 5,024.85 AED
25+ Dhs. 327.71 AED Dhs. 8,192.75 AED
50+ Dhs. 309.50 AED Dhs. 15,475.00 AED
100+ Dhs. 273.09 AED Dhs. 27,309.00 AED
N+ Dhs. 54.62 AED Price Inquiry
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Microsemi M1A3P600L-1FGG256I ProASIC3L FPGA

The M1A3P600L-1FGG256I is a high-performance field-programmable gate array (FPGA) from Microsemi's ProASIC3L family, designed for demanding industrial, automotive, aerospace, and telecommunications applications requiring reliable, low-power programmable logic solutions.

Key Features

  • 600,000 Logic Gates - Extensive logic capacity for complex digital designs
  • 177 I/O Pins - Flexible connectivity for interfacing with external systems
  • 110,592 RAM Bits - Integrated memory for data buffering and storage
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • Low Power Operation - Supply voltage range: 1.14V to 1.575V
  • Surface Mount Package - 256-FBGA (17x17mm) for compact PCB designs

Applications

Ideal for aerospace systems, automotive electronics, industrial control, telecommunications infrastructure, medical devices, and any application requiring long lifecycle support and proven reliability.

Technical Specifications

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series ProASIC3L
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 110592
Number of I/O 177
Number of Gates 600000
Voltage - Supply 1.14V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

Why Choose This FPGA?

As an authorized distributor, we provide genuine Microsemi components with full traceability, technical support, and long lifecycle commitment. This ProASIC3L FPGA offers the perfect balance of performance, reliability, and power efficiency for mission-critical applications.

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