XC3S1200E-4FGG400C

AMD Spartan-3E FPGA - XC3S1200E-4FGG400C

The XC3S1200E-4FGG400C is a high-performance FPGA from AMD's proven Spartan-3E family, delivering 1.2 million system gates and 304 I/O in a compact 400-ball fine-pitch BGA package. Engineered for cost-sensitive applications requiring substantial logic density, this device combines 19,512 logic cells with 516 Kbits of block RAM, making it ideal for industrial control, communications infrastructure, automotive systems, and aerospace applications.

Key Features & Benefits

• High Logic Density: 1.2M gates across 2,168 CLBs provide ample resources for complex digital designs
• Flexible I/O: 304 user I/O pins support diverse interface requirements and multi-protocol connectivity
• On-Chip Memory: 516 Kbits of distributed block RAM for buffering, FIFOs, and embedded processing
• Industrial Temperature Range: Qualified for 0°C to 85°C (TJ) operation in demanding environments
• Compact Footprint: 400-FBGA (21mm × 21mm) surface-mount package optimizes board space
• Low Power: 1.14V to 1.26V core supply voltage for energy-efficient operation
• RoHS Compliant: Meets environmental standards for global deployment

Typical Applications

This FPGA is widely deployed in embedded vision systems, motor control, protocol bridging, signal processing, and edge computing platforms where programmable logic, parallel processing, and real-time performance are critical.

Complete Technical Specifications

Product attributes	Property Value
Manufacturer	AMD
Product Series	Spartan®-3E
Packaging	Tray | Tray
Number of LABs/CLBs	2168
Number of Logic Elements/Cells	19512
Total RAM Bits	516096
Number of I/O	304
Number of Gates	1200000
Voltage - Supply	1.14V ~ 1.26V
Mounting Type	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)
Grade	-
Qualification	-
Package / Case	400-BGA
Supplier Device Package	400-FBGA (21x21)
ROHS

All specifications are subject to change. Please refer to the official AMD datasheet for complete design guidelines and electrical characteristics.