XC3S200-4FTG256C

AMD Spartan-3 XC3S200-4FTG256C FPGA - High-Performance Programmable Logic

The XC3S200-4FTG256C is a member of AMD's proven Spartan®-3 FPGA family, delivering exceptional performance and flexibility for industrial, automotive, aerospace, communications, and edge computing applications. With 200,000 gates and 173 I/O pins in a compact 256-FTBGA package, this device provides the perfect balance of logic density, I/O capability, and cost-effectiveness.

Key Features & Benefits

• High Logic Density: 4,320 logic elements across 480 CLBs enable complex digital designs
• Generous Memory: 221,184 total RAM bits for data buffering and processing
• Extensive I/O: 173 configurable I/O pins support diverse interface requirements
• Industrial Temperature Range: Reliable operation from 0°C to 85°C (TJ)
• Compact Footprint: 256-FTBGA (17x17mm) surface mount package saves board space
• Low Power: 1.14V ~ 1.26V supply voltage for energy-efficient designs
• RoHS Compliant: Meets environmental standards for global deployment

Ideal Applications

This FPGA is perfectly suited for embedded control systems, industrial automation, communications infrastructure, automotive electronics, aerospace instrumentation, and edge AI acceleration where reconfigurable logic, reliability, and proven technology are essential.

Technical Specifications

Product attributes	Property Value
Manufacturer	AMD
Product Series	Spartan®-3
Packaging	Tray | Tray
Number of LABs/CLBs	480
Number of Logic Elements/Cells	4320
Total RAM Bits	221184
Number of I/O	173
Number of Gates	200000
Voltage - Supply	1.14V ~ 1.26V
Mounting Type	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)
Grade	-
Qualification	-
Package / Case	256-LBGA
Supplier Device Package	256-FTBGA (17x17)
ROHS

Backed by AMD's industry-leading FPGA expertise and long product lifecycle support, the XC3S200-4FTG256C delivers the reliability and performance your mission-critical designs demand.