XCSU100P-2SBVC529I

AMD Spartan® UltraScale+™ FPGA - XCSU100P-2SBVC529I

The XCSU100P-2SBVC529I is a high-performance FPGA from AMD's Spartan® UltraScale+™ family, engineered for demanding embedded applications requiring substantial logic resources and exceptional I/O flexibility. This industrial-grade device delivers outstanding performance with 100,800 logic elements and 304 I/O pins in a compact 529-FCBGA package, making it ideal for space-constrained designs that demand reliability.

Key Features & Benefits:

• 100,800 Logic Elements - Extensive programmable logic capacity for complex FPGA designs and algorithms
• 5.3 Mb On-Chip RAM - High-speed embedded block RAM for efficient data buffering, processing, and storage
• 304 I/O Pins - Comprehensive connectivity options for interfacing with sensors, controllers, and external devices
• Industrial Temperature Range - Proven reliability from -40°C to 100°C (TJ) for harsh environments
• Compact 529-FCBGA Package - Space-efficient 19x19mm footprint optimized for embedded systems
• RoHS Compliant - Environmentally friendly, lead-free construction meeting global standards
• Low Power Consumption - Efficient 0.825V to 0.876V supply voltage for energy-sensitive applications

Target Applications:

The XCSU100P-2SBVC529I excels in industrial automation systems, embedded vision and image processing, precision motor control, communications infrastructure, test and measurement equipment, medical devices, aerospace systems, and high-performance computing applications requiring reconfigurable logic and real-time processing capabilities.

Why Choose AMD Spartan UltraScale+?

AMD's Spartan UltraScale+ family combines proven FPGA architecture with advanced 16nm FinFET technology, delivering superior performance-per-watt and cost-effectiveness. The XCSU100P variant offers an optimal balance of logic density, I/O count, and package size for mid-range embedded applications.

Complete Technical Specifications:

Product attributes	Property Value
Manufacturer	AMD
Product Series	Spartan® UltraScale+™
Packaging	Tray
Number of LABs/CLBs	-
Number of Logic Elements/Cells	100800
Total RAM Bits	5347738
Number of I/O	304
Voltage - Supply	0.825V ~ 0.876V
Operating Temperature	-40°C ~ 100°C (TJ)
Memory Type	Surface Mount
Grade	-
Qualification	-
Package / Case	529-BGA, FCBGA
Supplier Device Package	529-FCBGA (19x19)
ROHS

Ordering Information:

Part Number: XCSU100P-2SBVC529I
Availability: In Stock - Ready to Ship
Package Type: Industrial Tray Packaging

All specifications are subject to change without notice. Please refer to the official AMD datasheet for complete technical details and design guidelines.