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Seeed Technology Co., Ltd

Sipeed MAIX-I RISC-V Dual Core 64-bit AI Module - 600MHz Neural Network Processor

Regular price Dhs. 40.95
Regular price Dhs. 43.08 Sale price Dhs. 40.95
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Quantity Unit Price Total Price
1 Dhs. 40.95 AED Dhs. 40.95 AED
15+ Dhs. 39.63 AED Dhs. 594.45 AED
25+ Dhs. 38.77 AED Dhs. 969.25 AED
50+ Dhs. 36.62 AED Dhs. 1,831.00 AED
100+ Dhs. 32.31 AED Dhs. 3,231.00 AED
N+ Dhs. 6.46 AED Price Inquiry
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Recycling Electronic Components

Sipeed MAIX-I RISC-V AI Development Module

The Sipeed MAIX-I is a powerful AI-capable development module featuring a RISC-V dual core 64-bit processor running at 600MHz. Designed for edge computing and embedded AI applications, this module integrates a Neural Network Processor (KPU) and Audio Processor (APU) to enable advanced machine learning capabilities in compact form factor.

Key Features:

  • High-Performance Processing: RISC-V dual core 64-bit architecture at 600MHz
  • AI Acceleration: Dedicated Neural Network Processor (KPU) for machine learning inference
  • Audio Processing: Built-in Audio Processor (APU) for voice recognition and audio applications
  • Flexible Memory: 8MB RAM with configurable flash options (8MB/16MB/128MB)
  • Rich Connectivity: I2C, SPI, UART/USART interfaces
  • Advanced Peripherals: DMA, I2S, PWM, WDT support
  • Wide Operating Range: -30°C to 85°C temperature tolerance

Applications:

Perfect for AI vision systems, voice recognition, IoT edge devices, robotics, and embedded machine learning projects requiring low power consumption and high computational efficiency.

Product attributes Property Value
Manufacturer Seeed Technology Co., Ltd
Product Series Sipeed MAIX-I
Packaging Bulk |
Part Status Obsolete
Architecture MPU
Core Processor RISC-V Dual Core 64bit
Flash Size 8MB/16MB/128MB
RAM Size 8MB
Peripherals DMA, I2S, PWM, WDT
Connectivity I2C, SPI, UART/USART
Speed 600MHz
Primary Attributes Audio Processor (APU), Neural Network Processor (KPU)
Operating Temperature -30°C ~ 85°C
Grade -
Qualification -
Package / Case Module
Supplier Device Package Module

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