Altera 1SX280LN3F43E3VGS1

Skip to product information
1 of 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Regular price $11,349.71
Regular price $11,947.06 Sale price $11,349.71
Sale Sold out
Quantity Unit Price Total Price
1 $11,349.71 $11,349.71
15+ $10,991.30 $164,869.50
25+ $10,752.35 $268,808.75
50+ $10,155.00 $507,750.00
100+ $8,960.30 $896,030.00
N+ $1,792.06 Price Inquiry
Shipping calculated at checkout.
Quantity
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer Altera
Product Series Stratix® 10 SX
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.5GHz
Primary Attributes FPGA - 2800K Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FBGA, FC (42.5x42.5)

Intel Stratix 10 SX FPGA System-on-Chip Overview

The 1SX280LN3F43E3VGS1 is a high-performance FPGA System-on-Chip from Intel's Stratix® 10 SX family, combining advanced FPGA fabric with embedded Quad ARM® Cortex®-A53 MPCore™ processing. Engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications requiring both programmable logic and high-speed processing capabilities.

Key Features & Benefits

  • Hybrid Architecture: Combines 2800K logic element FPGA fabric with Quad ARM Cortex-A53 MPCore processors running at 1.5GHz for flexible, high-performance computing
  • Industrial-Grade Reliability: Operating temperature range of 0°C to 100°C (TJ) ensures stable performance in harsh environments
  • Rich Connectivity: Integrated peripherals including Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
  • Advanced Memory: 256KB on-chip RAM with DMA and watchdog timer support for efficient data processing
  • Compact High-Density Package: 1760-FBGA (42.5x42.5mm) footprint optimized for space-constrained designs

Ideal Applications

  • Industrial automation and control systems
  • Automotive ADAS and infotainment platforms
  • Aerospace and defense embedded systems
  • 5G/LTE communications infrastructure
  • Edge AI and machine learning acceleration
  • High-speed data acquisition and processing

Authentic Intel/Altera component with full traceability and quality assurance. Suitable for professional engineering and production applications.