Microsemi Corporation A2F060M3E-1FGG256I

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Microsemi A2F060M3E-1FGG256I SmartFusion® System-on-Chip (SoC)

The A2F060M3E-1FGG256I is a high-performance SmartFusion® system-on-chip (SoC) from Microsemi Corporation, combining an ARM® Cortex®-M3 microcontroller with a ProASIC®3 FPGA fabric. This integrated architecture delivers flexible, programmable logic alongside robust embedded processing for aerospace, automotive, industrial, medical, and telecom applications requiring high reliability and long lifecycle support.

Key Features

  • Dual Architecture: ARM Cortex-M3 MCU + 60K gate ProASIC®3 FPGA with 1,536 D-flip-flops
  • Processing Speed: 100MHz core frequency for real-time control and signal processing
  • Memory: 128KB Flash + 16KB RAM for program and data storage
  • Connectivity: EBI/EMI, I²C, SPI, UART/USART interfaces for versatile system integration
  • Peripherals: DMA, Power-On Reset (POR), Watchdog Timer (WDT)
  • Industrial Temperature Range: -40°C to +100°C (TJ) for harsh environments
  • Package: 256-LBGA / 256-FPBGA (17×17mm) for compact board designs

Applications

Ideal for motor control, sensor fusion, industrial automation, medical instrumentation, and embedded vision systems where FPGA acceleration and MCU control are required in a single device.

Design Support

Full traceability, RoHS/REACH compliance, datasheets, reference designs, and technical resources available to support design-in and production sourcing.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray |
Part Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 100MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)