Microsemi Corporation A2F060M3E-CSG288

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Regular price Dhs. 66.95
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Microsemi A2F060M3E-CSG288 SmartFusion® System-on-Chip

The A2F060M3E-CSG288 is a high-performance SmartFusion® cSoC (customizable System-on-Chip) from Microsemi Corporation, combining an ARM® Cortex®-M3 microcontroller with ProASIC®3 FPGA fabric in a single 288-pin CSP package. This integrated architecture delivers the flexibility of programmable logic with the deterministic performance of a hard processor core, making it ideal for aerospace, industrial control, medical devices, and telecommunications applications requiring both processing power and hardware acceleration.

Key Features & Benefits

  • Dual Architecture: ARM® Cortex®-M3 MCU core integrated with 60K-gate ProASIC®3 FPGA fabric for maximum design flexibility
  • High-Speed Processing: 80MHz operation enables real-time control and signal processing
  • Generous Memory: 128KB embedded Flash and 16KB RAM for program storage and data buffering
  • Rich Peripheral Set: DMA, POR, WDT for robust system management
  • Versatile Connectivity: EBI/EMI, I²C, SPI, UART/USART interfaces support diverse communication protocols
  • Industrial Temperature Range: 0°C to 85°C (TJ) operation for demanding environments
  • Compact Footprint: 288-pin TFBGA/CSPBGA (11×11mm) package optimizes board space

Typical Applications

  • Motor control and industrial automation
  • Medical instrumentation and diagnostic equipment
  • Aerospace and defense embedded systems
  • Telecommunications infrastructure
  • Custom protocol implementation and hardware acceleration
  • Mixed-signal data acquisition systems

Note: This product is marked as obsolete by the manufacturer. Please contact us for availability, alternative recommendations, or last-time-buy opportunities.

Why Choose This SmartFusion SoC?

The A2F060M3E-CSG288 eliminates the need for separate MCU and FPGA components, reducing BOM costs, board complexity, and power consumption. The tightly integrated architecture provides deterministic real-time performance while enabling custom hardware acceleration for compute-intensive tasks. Full traceability and RoHS/REACH compliance ensure suitability for regulated industries.

All products ship with full manufacturer traceability documentation and comply with current RoHS/REACH regulations.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray |
Part Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 288-TFBGA, CSPBGA
Supplier Device Package 288-CSP (11x11)