Microsemi Corporation A2F060M3E-FG256I

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Regular price Dhs. 75.75
Regular price Dhs. 79.72 Sale price Dhs. 75.75
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100+ Dhs. 59.79 Dhs. 5,979.00
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Microsemi A2F060M3E-FG256I SmartFusion® System-on-Chip (SoC)

The A2F060M3E-FG256I is a high-performance SmartFusion® system-on-chip from Microsemi Corporation that integrates an ARM® Cortex®-M3 microcontroller with ProASIC®3 FPGA fabric, delivering a powerful and flexible solution for embedded applications requiring both processing and programmable logic capabilities.

Key Features

  • Dual Architecture: ARM Cortex-M3 MCU + ProASIC3 FPGA (60K gates, 1536 D-Flip-Flops)
  • Processing Speed: 80MHz ARM Cortex-M3 core
  • Memory: 128KB Flash, 16KB RAM
  • Connectivity: EBI/EMI, I²C, SPI, UART/USART interfaces
  • Peripherals: DMA, Power-On Reset (POR), Watchdog Timer (WDT)
  • Industrial Temperature Range: -40°C to 100°C (TJ)
  • Package: 256-LBGA / 256-FPBGA (17x17mm)

Applications

Ideal for industrial control systems, motor control, communications infrastructure, automotive electronics, and aerospace applications requiring integrated MCU and FPGA functionality with robust temperature performance.

Note: This product is marked as obsolete. Please verify availability and consider newer alternatives from the SmartFusion2 or IGLOO2 families for new designs.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray |
Part Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)