Microsemi Corporation A2F060M3E-FG256M

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Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -55°C ~ 125°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

Microsemi A2F060M3E-FG256M SmartFusion® System-on-Chip

The A2F060M3E-FG256M is a high-performance SmartFusion® configurable System-on-Chip (cSoC) combining an ARM® Cortex®-M3 microcontroller with ProASIC®3 FPGA fabric. Designed for industrial, automotive, aerospace, and communications applications requiring secure, reliable embedded processing with programmable logic.

Key Features

  • Dual Architecture: ARM Cortex-M3 MCU + 60K gate ProASIC3 FPGA with 1,536 D-flip-flops
  • Processing Power: 80MHz ARM core with 128KB Flash and 16KB RAM
  • Extended Temperature Range: -55°C to 125°C (TJ) for harsh environments
  • Rich Connectivity: I2C, SPI, UART/USART, EBI/EMI interfaces
  • Integrated Peripherals: DMA, Power-On Reset (POR), Watchdog Timer (WDT)
  • Compact Package: 256-pin FPBGA (17×17mm)

Applications

Ideal for motor control, industrial automation, secure communications, avionics systems, and mixed-signal processing requiring both deterministic control and flexible FPGA logic.