Microsemi Corporation A2F060M3E-FGG256
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 66.94 | Dhs. 66.94 |
| 15+ | Dhs. 64.82 | Dhs. 972.30 |
| 25+ | Dhs. 63.41 | Dhs. 1,585.25 |
| 50+ | Dhs. 59.89 | Dhs. 2,994.50 |
| 100+ | Dhs. 52.85 | Dhs. 5,285.00 |
| N+ | Dhs. 10.57 | Price Inquiry |
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Microsemi A2F060M3E-FGG256 SmartFusion® System-on-Chip (SoC)
The A2F060M3E-FGG256 is a high-performance mixed-signal System-on-Chip (SoC) from Microsemi's SmartFusion® family, integrating an ARM® Cortex®-M3 microcontroller core with a ProASIC®3 FPGA fabric (60K gates, 1536 D-Flip-Flops). This unique architecture delivers the flexibility of programmable logic with the deterministic performance of a hard processor, making it ideal for aerospace, industrial control, medical devices, and secure embedded applications.
Key Features & Benefits
- Dual Architecture: ARM Cortex-M3 MCU + ProASIC3 FPGA for maximum design flexibility
- High Performance: 80MHz processor speed with 128KB Flash and 16KB RAM
- Rich Connectivity: EBI/EMI, I²C, SPI, UART/USART interfaces
- Integrated Peripherals: DMA, Power-On Reset (POR), Watchdog Timer (WDT)
- Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation
- Compact Package: 256-pin Fine-Pitch BGA (17x17mm) for space-constrained designs
Typical Applications
- Motor control and industrial automation
- Medical instrumentation and diagnostics
- Aerospace and defense systems
- Secure communications and cryptography
- High-reliability embedded systems
Design Support & Resources
Full technical documentation, reference designs, and datasheets available. Our engineering team provides design-in support to accelerate your time-to-market.
Note: This product is marked as obsolete. Please contact our team for availability, last-time-buy opportunities, or recommended alternatives.
Quality & Compliance
All components ship with full traceability documentation and comply with RoHS/REACH regulations. Authorized distributor with manufacturer-backed warranty.
| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | SmartFusion® |
| Packaging | Tray | |
| Part Status | Obsolete |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 128KB |
| RAM Size | 16KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Speed | 80MHz |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
A2F060M3E-FGG256.pdf