Microsemi Corporation A2F060M3E-FGG256I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 75.75 | Dhs. 75.75 |
| 15+ | Dhs. 73.34 | Dhs. 1,100.10 |
| 25+ | Dhs. 71.75 | Dhs. 1,793.75 |
| 50+ | Dhs. 67.76 | Dhs. 3,388.00 |
| 100+ | Dhs. 59.79 | Dhs. 5,979.00 |
| N+ | Dhs. 11.96 | Price Inquiry |
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Microsemi A2F060M3E-FGG256I SmartFusion® System-on-Chip
The A2F060M3E-FGG256I is a high-reliability SmartFusion® System-on-Chip (SoC) from Microsemi Corporation, combining an ARM® Cortex®-M3 microcontroller with a ProASIC®3 FPGA in a single 256-FBGA package. Designed for aerospace, automotive, industrial, medical, and telecom applications requiring long lifecycle availability and full traceability.
Key Features & Benefits
- Dual Architecture: ARM Cortex-M3 MCU + 60K-gate FPGA with 1536 D-Flip-Flops
- High Performance: 80MHz processing speed for real-time control and signal processing
- Memory: 128KB Flash + 16KB RAM for embedded applications
- Rich Connectivity: EBI/EMI, I²C, SPI, UART/USART interfaces
- Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
- Integrated Peripherals: DMA, POR, WDT for robust system design
- Compact Package: 256-FPBGA (17x17mm) for space-constrained designs
Design-In Support
We provide comprehensive technical resources including datasheets, reference designs, and application notes to accelerate your development cycle. Our team offers design-in guidance for FPGA configuration, firmware integration, and system optimization.
Quality & Compliance
All units ship with full traceability documentation and comply with RoHS/REACH standards. Available in tray packaging for production-scale sourcing with global shipping support.
Note: This product is marked as obsolete. Contact us for availability, alternative recommendations, or last-time-buy opportunities.
| Product attributes | Property Value |
| Manufacturer | Microsemi Corporation |
| Product Series | SmartFusion® |
| Packaging | Tray | |
| Part Status | Obsolete |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 128KB |
| RAM Size | 16KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Speed | 80MHz |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
A2F060M3E-FGG256I.pdf