Microsemi Corporation A2F060M3E-FGG256M

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Microsemi A2F060M3E-FGG256M SmartFusion® System-on-Chip

The A2F060M3E-FGG256M is a high-performance SmartFusion® mixed-signal system-on-chip (SoC) combining an ARM® Cortex®-M3 microcontroller with ProASIC®3 FPGA fabric. Designed for industrial, automotive, aerospace, and communications applications requiring programmable logic with embedded processing.

Key Features

  • ARM Cortex-M3 Core: 80MHz processor with 128KB Flash and 16KB RAM
  • FPGA Fabric: 60K gates ProASIC®3 with 1,536 D-flip-flops for custom logic
  • Extended Temperature: -55°C to 125°C (TJ) for harsh environments
  • Rich Connectivity: I2C, SPI, UART/USART, EBI/EMI interfaces
  • Integrated Peripherals: DMA, POR, WDT for system reliability
  • Compact Package: 256-FPBGA (17x17mm) footprint

Applications

Ideal for motor control, sensor fusion, industrial automation, avionics, secure communications, and mixed-signal processing where FPGA flexibility meets MCU integration.

All specifications are from official Microsemi documentation. RoHS compliant. Authentic components with full traceability.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -55°C ~ 125°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)