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Microsemi AFS090-FGG256I Fusion® Mixed-Signal FPGA

The AFS090-FGG256I is a high-performance mixed-signal FPGA from Microsemi's Fusion® family, designed for demanding industrial applications requiring both programmable logic and analog functionality. This device combines 90,000 gates of FPGA fabric with integrated analog features, making it ideal for aerospace, automotive, industrial control, and telecommunications applications.

Key Features

  • 90,000 System Gates - Ample logic resources for complex designs
  • 75 User I/O - Flexible connectivity options
  • 27,648 RAM Bits - On-chip memory for data buffering and processing
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
  • Low Power Operation - 1.425V to 1.575V supply voltage
  • Compact 256-FBGA Package - Space-efficient 17x17mm footprint
  • Surface Mount Technology - Suitable for automated assembly

Applications

  • Industrial automation and control systems
  • Aerospace and defense electronics
  • Automotive electronics
  • Telecommunications infrastructure
  • Medical device instrumentation
  • Test and measurement equipment

Why Choose This Component?

As an authorized distributor, we provide genuine Microsemi components with full traceability and lifecycle support. The AFS090-FGG256I offers exceptional reliability for mission-critical applications, backed by Microsemi's proven Fusion architecture and our commitment to quality assurance.

Stock Availability: Contact us for current inventory levels, lead times, and volume pricing. We support global shipping and offer technical design-in assistance.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 27648
Number of I/O 75
Number of Gates 90000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)