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Microsemi AFS250-QNG180I Fusion® Mixed-Signal FPGA

The AFS250-QNG180I is a high-performance mixed-signal FPGA from Microsemi's Fusion® family, designed for demanding industrial, automotive, aerospace, and telecommunications applications. This device combines 250,000 gates with 65 I/O pins in a compact 180-pin QFN package, offering exceptional integration and reliability for embedded systems requiring both digital logic and analog functionality.

Key Features & Benefits

  • 250,000 Gates - Ample logic resources for complex digital designs and signal processing
  • 65 I/O Pins - Flexible connectivity for interfacing with sensors, controllers, and communication buses
  • 36,864 RAM Bits - Embedded memory for data buffering and state machines
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ) for harsh environments
  • Compact 180-QFN Package - Space-efficient 10x10mm footprint ideal for size-constrained designs
  • Surface Mount Technology - Streamlined PCB assembly and manufacturing
  • Mixed-Signal Capability - Integrates analog and digital functions on a single chip

Typical Applications

This FPGA is ideal for aerospace avionics, automotive control systems, industrial automation, medical instrumentation, telecommunications infrastructure, and any application requiring long lifecycle support and proven reliability.

All specifications are guaranteed by the manufacturer. Full traceability and compliance documentation available upon request.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 36864
Number of I/O 65
Number of Gates 250000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 180-WFQFN Dual Rows, Exposed Pad
Supplier Device Package 180-QFN (10x10)