Altera AGFA019R31C3E3E

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Intel Altera AGFA019R31C3E3E - Agilex F Series FPGA System-on-Chip

The AGFA019R31C3E3E is a high-performance FPGA SoC from Intel Altera's Agilex F product family, engineered for demanding aerospace, automotive, industrial, and telecommunications applications requiring exceptional processing power and flexibility.

Key Features

  • Advanced Processing: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, and floating-point capabilities running at 1.4GHz
  • Massive Logic Capacity: 1.9 million logic elements for complex FPGA implementations
  • Industrial-Grade Reliability: Operating temperature range of 0°C to 100°C (TJ)
  • Comprehensive Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces
  • Compact High-Density Package: 3184-BGA (56x45mm) with exposed pad for enhanced thermal performance

Applications

Ideal for high-bandwidth data processing, embedded vision systems, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation controllers, and mission-critical aerospace applications.

Authenticity & Support

Sourced directly from authorized distributors with full manufacturer documentation, traceability, and long lifecycle commitment. Each unit ships in factory-sealed tray packaging with complete technical datasheets and reference designs.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 1.9M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)