Altera AGFA023R24C2I3E

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Altera AGFA023R24C2I3E - Agilex F Series FPGA with Embedded ARM Processor

The AGFA023R24C2I3E from Altera represents a high-performance System-on-Chip (SoC) solution combining a powerful FPGA fabric with an embedded ARM processor subsystem. This device is engineered for demanding applications in aerospace, automotive, telecommunications, and industrial control systems requiring both programmable logic and high-performance processing.

Key Features & Benefits

  • 2.3 Million Logic Elements - Massive FPGA fabric for complex digital designs and signal processing
  • Quad ARM Cortex-A53 MPCore - High-performance 1.4GHz processor with NEON SIMD and floating-point support
  • 256KB On-Chip RAM - Fast embedded memory for critical data and code execution
  • Rich Connectivity - Ethernet, USB OTG, SPI, I2C, UART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range - Operates reliably from -40°C to 100°C (junction temperature)
  • 2340-BFBGA Package - High-density 45x42mm BGA with exposed pad for thermal management

Ideal Applications

This Agilex F device excels in applications requiring both hardware acceleration and software flexibility: embedded vision systems, 5G wireless infrastructure, industrial automation controllers, aerospace avionics, automotive ADAS platforms, and high-speed data acquisition systems.

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Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

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