Altera AGFA023R24C3E4X
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 83,316.42 | Dhs. 83,316.42 |
| 15+ | Dhs. 80,685.37 | Dhs. 1,210,280.55 |
| 25+ | Dhs. 78,931.34 | Dhs. 1,973,283.50 |
| 50+ | Dhs. 74,546.27 | Dhs. 3,727,313.50 |
| 100+ | Dhs. 65,776.12 | Dhs. 6,577,612.00 |
| N+ | Dhs. 13,155.22 | Price Inquiry |
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Altera Agilex™ F FPGA System-on-Chip - AGFA023R24C3E4X
The AGFA023R24C3E4X is a cutting-edge FPGA System-on-Chip from Intel's Altera Agilex™ F series, combining a powerful Quad-Core ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz with an impressive 2.3 million logic elements. This high-performance heterogeneous computing platform delivers exceptional processing power and FPGA flexibility for the most demanding applications in data centers, telecommunications, aerospace, defense, and advanced embedded systems.
Key Features & Benefits
- Quad ARM Cortex-A53 MPCore Processor: Four 64-bit ARM cores at 1.4GHz with CoreSight debug, ARM NEON SIMD engine, and hardware floating-point for superior application processing and real-time control
- 2.3 Million Logic Elements: Massive FPGA fabric resources enabling complex digital designs, custom hardware acceleration, AI/ML inference, and parallel processing at unprecedented scale
- 256KB On-Chip RAM: High-speed embedded memory for data buffering, lookup tables, and performance-critical operations
- Advanced Connectivity Suite: Integrated Ethernet, USB OTG, MMC/SD/SDIO, I2C, SPI, UART/USART, and EBI/EMI interfaces for comprehensive system integration
- High-Performance Peripherals: DMA controllers and watchdog timer (WDT) for efficient data movement and system reliability
- Industrial Operating Range: 0°C to 100°C (TJ) junction temperature for reliable operation in demanding environments
- High-Density 2340-BGA Package: 45x42mm FBGA with exposed pad for superior thermal performance and signal integrity
- Intel Agilex Architecture: Second-generation 10nm SuperFin process technology delivering industry-leading performance per watt
- Heterogeneous Computing Platform: Seamlessly combine ARM processor software flexibility with FPGA hardware acceleration
Target Applications
The AGFA023R24C3E4X is engineered for high-performance applications requiring both intensive processing and programmable logic:
- Data Center Acceleration: SmartNIC, storage acceleration, compression/decompression, encryption, and custom packet processing
- 5G/6G Wireless Infrastructure: Baseband processing, beamforming, massive MIMO, O-RAN compliant radio units
- Network Equipment: High-speed routers, switches, deep packet inspection, SDN/NFV platforms
- Aerospace & Defense: Radar signal processing, software-defined radio, secure communications, avionics
- High-Performance Computing: Custom compute accelerators, AI/ML inference engines, scientific computing
- Test & Measurement: High-speed data acquisition, real-time signal processing, protocol analyzers
- Broadcast & Video: 8K/16K video processing, transcoding, broadcast infrastructure, professional AV equipment
- Industrial Automation: Advanced motion control, machine vision, predictive maintenance, edge AI
Why Choose Agilex F FPGA SoC?
Intel's Agilex F series represents the pinnacle of FPGA technology, combining proven ARM Cortex-A53 processors with next-generation FPGA fabric built on advanced 10nm process technology. This heterogeneous architecture enables you to:
- Accelerate compute-intensive workloads with custom FPGA logic while running Linux and complex software on ARM cores
- Achieve industry-leading performance per watt for power-constrained applications
- Implement custom interfaces, protocols, and IP blocks alongside standard processor peripherals
- Scale performance dynamically by partitioning workloads between processor and FPGA fabric
- Future-proof designs with reconfigurable hardware that adapts to evolving standards
Development Ecosystem & Support
The AGFA023R24C3E4X is supported by Intel's comprehensive Quartus® Prime development suite, including advanced synthesis, place-and-route tools, timing analysis, and power optimization. ARM development is supported through industry-standard toolchains including GCC, Linux BSPs, and real-time operating systems.
Package & Ordering Information
Part Number: AGFA023R24C3E4X
Package Type: 2340-pin Ball Grid Array (BGA) with exposed thermal pad
Package Dimensions: 45mm × 42mm
Part Status: Active - Available for new designs
Packaging: Tray
Quality & Authenticity Guarantee
- 100% Genuine Intel/Altera Product: Factory-sealed components with full traceability
- Active Part Status: Current production, long-term availability assured
- Fast Global Shipping: Quick dispatch with reliable logistics partners
- Technical Support: Expert assistance for design-in and application optimization
- Volume Pricing Available: Competitive pricing for production quantities
- Quality Assurance: Rigorous testing and compliance verification
Ready to accelerate your next-generation design? Order the AGFA023R24C3E4X today and harness the power of heterogeneous computing with Intel Agilex F FPGA SoC technology.
| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Agilex F |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1.4GHz |
| Primary Attributes | FPGA - 2.3M Logic Elements |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2340-BFBGA Exposed Pad |
| Supplier Device Package | 2340-BGA (45x42) |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
