Altera AGFA023R24C3E4X

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Altera Agilex™ F FPGA System-on-Chip - AGFA023R24C3E4X

The AGFA023R24C3E4X is a cutting-edge FPGA System-on-Chip from Intel's Altera Agilex™ F series, combining a powerful Quad-Core ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz with an impressive 2.3 million logic elements. This high-performance heterogeneous computing platform delivers exceptional processing power and FPGA flexibility for the most demanding applications in data centers, telecommunications, aerospace, defense, and advanced embedded systems.

Key Features & Benefits

  • Quad ARM Cortex-A53 MPCore Processor: Four 64-bit ARM cores at 1.4GHz with CoreSight debug, ARM NEON SIMD engine, and hardware floating-point for superior application processing and real-time control
  • 2.3 Million Logic Elements: Massive FPGA fabric resources enabling complex digital designs, custom hardware acceleration, AI/ML inference, and parallel processing at unprecedented scale
  • 256KB On-Chip RAM: High-speed embedded memory for data buffering, lookup tables, and performance-critical operations
  • Advanced Connectivity Suite: Integrated Ethernet, USB OTG, MMC/SD/SDIO, I2C, SPI, UART/USART, and EBI/EMI interfaces for comprehensive system integration
  • High-Performance Peripherals: DMA controllers and watchdog timer (WDT) for efficient data movement and system reliability
  • Industrial Operating Range: 0°C to 100°C (TJ) junction temperature for reliable operation in demanding environments
  • High-Density 2340-BGA Package: 45x42mm FBGA with exposed pad for superior thermal performance and signal integrity
  • Intel Agilex Architecture: Second-generation 10nm SuperFin process technology delivering industry-leading performance per watt
  • Heterogeneous Computing Platform: Seamlessly combine ARM processor software flexibility with FPGA hardware acceleration

Target Applications

The AGFA023R24C3E4X is engineered for high-performance applications requiring both intensive processing and programmable logic:

  • Data Center Acceleration: SmartNIC, storage acceleration, compression/decompression, encryption, and custom packet processing
  • 5G/6G Wireless Infrastructure: Baseband processing, beamforming, massive MIMO, O-RAN compliant radio units
  • Network Equipment: High-speed routers, switches, deep packet inspection, SDN/NFV platforms
  • Aerospace & Defense: Radar signal processing, software-defined radio, secure communications, avionics
  • High-Performance Computing: Custom compute accelerators, AI/ML inference engines, scientific computing
  • Test & Measurement: High-speed data acquisition, real-time signal processing, protocol analyzers
  • Broadcast & Video: 8K/16K video processing, transcoding, broadcast infrastructure, professional AV equipment
  • Industrial Automation: Advanced motion control, machine vision, predictive maintenance, edge AI

Why Choose Agilex F FPGA SoC?

Intel's Agilex F series represents the pinnacle of FPGA technology, combining proven ARM Cortex-A53 processors with next-generation FPGA fabric built on advanced 10nm process technology. This heterogeneous architecture enables you to:

  • Accelerate compute-intensive workloads with custom FPGA logic while running Linux and complex software on ARM cores
  • Achieve industry-leading performance per watt for power-constrained applications
  • Implement custom interfaces, protocols, and IP blocks alongside standard processor peripherals
  • Scale performance dynamically by partitioning workloads between processor and FPGA fabric
  • Future-proof designs with reconfigurable hardware that adapts to evolving standards

Development Ecosystem & Support

The AGFA023R24C3E4X is supported by Intel's comprehensive Quartus® Prime development suite, including advanced synthesis, place-and-route tools, timing analysis, and power optimization. ARM development is supported through industry-standard toolchains including GCC, Linux BSPs, and real-time operating systems.

Package & Ordering Information

Part Number: AGFA023R24C3E4X
Package Type: 2340-pin Ball Grid Array (BGA) with exposed thermal pad
Package Dimensions: 45mm × 42mm
Part Status: Active - Available for new designs
Packaging: Tray

Quality & Authenticity Guarantee

  • 100% Genuine Intel/Altera Product: Factory-sealed components with full traceability
  • Active Part Status: Current production, long-term availability assured
  • Fast Global Shipping: Quick dispatch with reliable logistics partners
  • Technical Support: Expert assistance for design-in and application optimization
  • Volume Pricing Available: Competitive pricing for production quantities
  • Quality Assurance: Rigorous testing and compliance verification

Ready to accelerate your next-generation design? Order the AGFA023R24C3E4X today and harness the power of heterogeneous computing with Intel Agilex F FPGA SoC technology.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.