AGFB006R24D2I3V
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 24,752.15 AED | Dhs. 24,752.15 AED |
| 15+ | Dhs. 23,970.50 AED | Dhs. 359,557.50 AED |
| 25+ | Dhs. 23,449.40 AED | Dhs. 586,235.00 AED |
| 50+ | Dhs. 22,146.66 AED | Dhs. 1,107,333.00 AED |
| 100+ | Dhs. 19,541.17 AED | Dhs. 1,954,117.00 AED |
| N+ | Dhs. 3,908.23 AED | Price Inquiry |
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Altera AGFB006R24D2I3V - Agilex F Series FPGA System-on-Chip
The AGFB006R24D2I3V is a high-performance FPGA System-on-Chip from Altera's Agilex F series, combining a powerful Quad ARM® Cortex®-A53 MPCore™ processor with 573K logic elements FPGA fabric. This advanced SoC delivers exceptional processing power and flexibility for demanding embedded applications in industrial, automotive, aerospace, medical, and telecommunications sectors.
Key Features:
- Quad-core ARM Cortex-A53 MPCore with CoreSight™, ARM NEON, and floating-point capabilities running at 1.4GHz
- 573K Logic Elements FPGA for customizable hardware acceleration and parallel processing
- 256KB integrated RAM for efficient data handling
- Rich connectivity options: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Industrial temperature range: -40°C to 100°C (TJ) for harsh environments
- Advanced peripherals: DMA, Watchdog Timer (WDT)
- Compact 2340-BGA package (45x42mm) with exposed pad for enhanced thermal performance
Applications:
Ideal for high-reliability applications requiring long lifecycle support including industrial automation, medical imaging systems, aerospace avionics, automotive ADAS, 5G telecommunications infrastructure, and defense systems.
Compliance: RoHS and REACH compliant. Full traceability documentation available. Authorized distributor with access to manufacturer lifecycle programs ensuring long-term availability for critical applications.
| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Agilex F |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1.4GHz |
| Primary Attributes | FPGA - 573K Logic Elements |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2340-BFBGA Exposed Pad |
| Supplier Device Package | 2340-BGA (45x42) |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
